| ISBN |
: 9781138033566 |
| Kolasi |
: xviii, 322 halaman: gambar, tabel; 24 cm. |
| Materi Koleksi |
: Buku-Bacaan Pendukung |
| Bahasa |
: Inggris |
| Subjek |
: Printed circuits--Design and construction--Electrical engineering ; Sirkuit cetak--Desain dan konstruksi--Teknik elektro |
| Kata Kunci |
: Electromagnetics, EMC modeling, EMC challenges, Modal field of power, integral equation, extraction, interposer electromagnetics, compatibility design ; Elektromagnetik, pemodelan EMC, tantangan EMC, bidang modal daya, persamaan integral, ekstraksi, inter |
| Keterangan |
: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications. |
