.245
a	Modeling and design of electromagnetic compatibility for high-speed printed circuit board and packaging
h	Buku-Bacaan Pendukung
.020
a	9781138033566
.100
a	WEI, Xin-Chang
.005
a	20181109135444
.260
a	Boca Raton, Florida
b	CRC Press
c	2017
.041
a	Inggris
.084
a	621.381531 WEI
.300
a	xviii, 322 halaman: gambar, tabel
b	24 cm.
c	xviii, 322 halaman: gambar, tabel; 24 cm.
.336
a	Buku-Bacaan Pendukung